An Ultra-Clean Valve Series, incorporating a

metal Tied-Diaphragm and a unique design with

a replaceable valve core. This series is intended

to be used in a variety of High-Flow High-Purity

applications in the semiconductor industry, mainly

applicable in the Sub-Fab floor.

•  

• FEATURES AND BENEFITS

  • Versatile purge port configurations
  • Advanced replaceable valve core design, a quick and easy replacement with one simple operation
  • High quality materials SST 316L or 316L VAR, electropolished internal wetted surfaces option available.